Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Shape | Width | Length | Height | Material | Plating | Plating - Thickness | Attachment Method | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() |
4593PAH1K01800RFI FOF GASKET PU ADH Laird Technologies EMI |
219 |
|
![]() Datasheet |
Sculpted Foam UL94 | Bulk | Active | Fabric Over Foam | C-Fold | 0.280" (7.10mm) | 18.000" (457.20mm) | 0.252" (6.40mm) | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | - | - | Adhesive | - |
![]() |
0097044002RFI FINGERSTOCK BECU HARDWARE Laird Technologies EMI |
106 |
|
![]() Datasheet |
Large Enclosure | Bulk | Active | Fingerstock | - | 1.630" (41.40mm) | 16.000" (406.40mm) | 0.410" (10.41mm) | Beryllium Copper | - | - | Hardware, Rivet, Solder | 121°C |
![]() |
8864-0100-89RFI GASKET FOOT Laird Technologies EMI |
461 |
|
![]() Datasheet |
- | Digi-Spool®, Continuous Spool | Active | Gasket | Round | 0.125" (3.18mm) | Enter Number of Feet in Order Quantity | - | - | - | - | - | - |
|
0097055502RFI FINGERSTOCK BECU NICKEL ADH Laird Technologies EMI |
104 |
|
![]() Datasheet |
Twist | Box | Active | Fingerstock | - | 0.340" (8.64mm) | 23.976" (609.00mm) | 0.070" (1.78mm) | Beryllium Copper | Nickel, Tin | 299.99µin (7.62µm) | Adhesive | 121°C |
|
0097097202RFI FINGERSTOCK BECU NICKEL CLIP Laird Technologies EMI |
246 |
|
![]() Datasheet |
Divider Edge | Bulk | Active | Fingerstock | - | 0.060" (1.52mm) | 12.008" (305.00mm) | 0.052" (1.32mm) | Beryllium Copper | Nickel, Tin | 299.99µin (7.62µm) | Clip | - |
![]() |
0097055802RFI FINGERSTOCK BECU ADH Laird Technologies EMI |
178 |
|
![]() Datasheet |
Twist | Box | Active | Fingerstock | - | 0.200" (5.08mm) | 24.000" (609.60mm) | 0.070" (1.78mm) | Beryllium Copper | - | - | Adhesive | 121°C |
|
0097043602RFI FINGERSTOCK BECU HARDWARE Laird Technologies EMI |
153 |
|
![]() Datasheet |
Double-Sided Contact | Box | Active | Fingerstock | - | 0.940" (23.88mm) | 0.375" (9.53mm) | 0.250" (6.35mm) | Beryllium Copper | - | - | Hardware, Rivet, Solder | 121°C |
|
0077001402RFI FINGERSTOCK BECU NICKEL ADH Laird Technologies EMI |
337 |
|
![]() Datasheet |
No Snag | Box | Active | Fingerstock | - | 0.600" (15.24mm) | 23.976" (609.00mm) | 0.220" (5.59mm) | Beryllium Copper | Nickel, Tin | 299.99µin (7.62µm) | Adhesive | 121°C |
![]() |
BMI-C-001RFI FINGERSTOCK BECU GOLD SOLDER Laird Technologies EMI |
6,123 |
|
![]() Datasheet |
BMI-C | Tape & Reel (TR) | Active | Fingerstock | - | 0.078" (2.00mm) | 0.122" (3.11mm) | 0.096" (2.44mm) | Beryllium Copper | Gold | - | Solder | - |
![]() |
0077001702RFI FINGERSTOCK BECU SLOT Laird Technologies EMI |
17,915 |
|
![]() Datasheet |
Slot Mount | Bulk | Active | Fingerstock | - | 0.320" (8.13mm) | 0.356" (9.04mm) | 0.110" (2.79mm) | Beryllium Copper | - | - | Slot | 121°C |