Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Shape | Width | Length | Height | Material | Plating | Plating - Thickness | Attachment Method | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
0097043802RFI FINGERSTOCK BECU HARDWARE Laird Technologies EMI |
228 |
|
![]() Datasheet |
Large Enclosure | Box | Active | Fingerstock | - | 1.090" (27.69mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Beryllium Copper | - | - | Hardware, Rivet, Solder | 121°C |
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0097064002RFI FINGERSTOCK BECU NICKEL CLIP Laird Technologies EMI |
117 |
|
![]() Datasheet |
Clip-On | Box | Active | Fingerstock | - | 1.090" (27.68mm) | 15.984" (406.00mm) | 0.260" (6.60mm) | Beryllium Copper | Nickel, Tin | 299.99µin (7.62µm) | Clip | 121°C |
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21124373RFI ABSORB SHEET Laird Technologies EMI |
82 |
|
![]() Datasheet |
ECCOSORB® MF | Bulk | Active | Absorbing Sheet | Round | 0.250" (6.35mm) | 12.008" (305.00mm) | - | - | - | - | - | 180°C |
|
67SLG030030050PI00RFI FILM OVER FOAM PU SOLDER Laird Technologies EMI |
3,944 |
|
![]() Datasheet |
SMD Grounding Metallized | Tape & Reel (TR) | Active | Film Over Foam | Rectangle | 0.118" (3.00mm) | 0.197" (5.00mm) | 0.118" (3.00mm) | Polyurethane Foam, Tin-Copper Polyester (SN/CU) | - | - | Solder | -40°C ~ 70°C |
|
BMI-C-007-01RFI FINGERSTOCK BECU TIN SOLDER Laird Technologies EMI |
6,919 |
|
![]() Datasheet |
BMI-C | Tape & Reel (TR) | Active | Fingerstock | - | 0.059" (1.50mm) | 0.130" (3.30mm) | 0.126" (3.20mm) | Beryllium Copper | Tin | - | Solder | - |
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BMI-C-006RFI FINGERSTOCK BECU TIN SOLDER Laird Technologies EMI |
470 |
|
![]() Datasheet |
BMI-C | Tape & Reel (TR) | Active | Fingerstock | - | 0.079" (2.00mm) | 0.113" (2.86mm) | 0.100" (2.54mm) | Beryllium Copper | Tin | - | Solder | - |
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67B3G2504807010R0BRFI FINGERSTOCK BECU GOLD SOLDER Laird Technologies EMI |
330 |
|
![]() Datasheet |
B3G | Tape & Reel (TR) | Active | Fingerstock | - | 0.098" (2.50mm) | 0.189" (4.80mm) | 0.276" (7.00mm) | Beryllium Copper | Gold | - | Solder | - |
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67B3G3006010010R0CRFI FINGERSTOCK BECU GOLD SOLDER Laird Technologies EMI |
4,708 |
|
![]() Datasheet |
B3G | Tape & Reel (TR) | Active | Fingerstock | - | 0.119" (3.00mm) | 0.236" (6.00mm) | 0.394" (10.00mm) | Beryllium Copper | Gold | - | Solder | - |
|
4520PA51G01800RFI FOF GASKET PU ADH Laird Technologies EMI |
202 |
|
![]() Datasheet |
51G | Bulk | Active | Fabric Over Foam | Square | 0.079" (2.00mm) | 18.000" (457.20mm) | 0.079" (2.00mm) | Polyurethane Foam, Nickel-Copper Ripstop (NI/CU) | - | - | Adhesive | - |
|
4053PA51H01800RFI FOF GASKET PU ADH Laird Technologies EMI |
645 |
|
![]() Datasheet |
51H | Bulk | Active | Fabric Over Foam | D-Shape | 0.091" (2.30mm) | 18.000" (457.20mm) | 0.091" (2.30mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive | - |