Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Shape | Width | Length | Height | Material | Plating | Plating - Thickness | Attachment Method | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
4206PA51G01800RFI FOF GASKET ADH Laird Technologies EMI |
187 |
|
![]() Datasheet |
51G | Bulk | Active | Fabric Over Foam | Square | 0.394" (10.00mm) | 18.000" (457.20mm) | 0.394" (10.00mm) | - | - | - | Adhesive | - |
|
0077006102RFI FINGERSTOCK BECU SLOT Laird Technologies EMI |
1,028 |
|
![]() Datasheet |
Variable Slot Mount | Box | Active | Fingerstock | - | 0.320" (8.13mm) | 16.000" (406.40mm) | 0.110" (2.79mm) | Beryllium Copper | - | - | Slot | 121°C |
|
4131PA51H01800RFI FOF GASKET PU ADH Laird Technologies EMI |
141 |
|
![]() Datasheet |
51H | Bulk | Active | Fabric Over Foam | Bell | 0.500" (12.70mm) | 18.000" (457.20mm) | 0.142" (3.60mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive | - |
|
0077005702RFI FINGERSTOCK BECU SLOT Laird Technologies EMI |
102 |
|
![]() Datasheet |
Variable Slot Mount | Bag | Active | Fingerstock | - | 0.600" (15.24mm) | 16.000" (406.40mm) | 0.220" (5.59mm) | Beryllium Copper | - | - | Slot | 121°C |
|
BMI-C-002RFI FINGERSTOCK BECU GOLD SOLDER Laird Technologies EMI |
6,387 |
|
![]() Datasheet |
BMI-C | Tape & Reel (TR) | Active | Fingerstock | - | 0.394" (10.00mm) | 0.085" (2.17mm) | 0.100" (2.54mm) | Beryllium Copper | Gold | - | Solder | - |
![]() |
4223PA51G01800RFI FOF GASKET ADH Laird Technologies EMI |
177 |
|
![]() Datasheet |
51G | Bulk | Active | Fabric Over Foam | Rectangle | 0.157" (4.00mm) | 18.000" (457.20mm) | 0.039" (1.00mm) | - | - | - | Adhesive | - |
![]() |
LT18CJ1922RFI FINGERSTOCK BECU TIN SLOT Laird Technologies EMI |
500 |
|
![]() Datasheet |
LT18CJXXXX | Bulk | Active | Fingerstock | - | 0.320" (8.13mm) | 4.657" (118.28mm) | 0.110" (2.79mm) | Beryllium Copper | Tin | 299.99µin (7.62µm) | Slot | - |
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67BCG2004705710R00RFI FINGERSTOCK BECU GOLD SOLDER Laird Technologies EMI |
3,445 |
|
![]() Datasheet |
BCG | Bulk | Active | Fingerstock | - | 0.079" (2.00mm) | 0.185" (4.70mm) | 0.224" (5.70mm) | Beryllium Copper | Gold | - | Solder | - |
![]() |
67B3G2507009010R0BRFI FINGERSTOCK BECU GOLD SOLDER Laird Technologies EMI |
4,283 |
|
![]() Datasheet |
B3G | Tape & Reel (TR) | Active | Fingerstock | - | 0.098" (2.50mm) | 0.276" (7.00mm) | 0.354" (9.00mm) | Beryllium Copper | Gold | - | Solder | - |
![]() |
67B5G2504506010R00RFI FINGERSTOCK BECU GOLD SOLDER Laird Technologies EMI |
3,817 |
|
![]() Datasheet |
B5G | Bulk | Active | Fingerstock | - | 0.098" (2.50mm) | 0.177" (4.50mm) | 0.236" (6.00mm) | Beryllium Copper | Gold | - | Solder | - |