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Solder
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Mesh Type | Process | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NCSWLF.031 1LBLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
8 |
|
Datasheet |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 422 ~ 428°F (217 ~ 220°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
|
SMD291AX250T5SOLDER PASTE SN63/PB37 250G T5 Chip Quik Inc. |
15 |
|
Datasheet |
- | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD4300AX250T5SOLDER PASTE SN63/PB37 250G T5 Chip Quik Inc. |
14 |
|
Datasheet |
CHIPQUIK® SMD4300 | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean, Water Soluble | - | 5 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD291SNL250T5SOLDER PASTE SAC305 250G T5 Chip Quik Inc. |
6 |
|
Datasheet |
- | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
WS991SNL500T4SOLDER PASTE THERMALLY STABLE WS Chip Quik Inc. |
10 |
|
Datasheet |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | Water Soluble | - | 4 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | - |
|
TS991SNL500T4SOLDER PASTE THERMALLY STABLE NC Chip Quik Inc. |
9 |
|
Datasheet |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | 4 | Lead Free | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture | - |
|
SMD2SWLT.040 200GSN42/BI57.6/AG0.4 2.2% FLUX CORE Chip Quik Inc. |
7 |
|
Datasheet |
SMD2 | Bulk | Active | Wire Solder | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | - | Lead Free | Spool, 7 oz (200g) | - | - | - |
|
NC2SWLF.031 0.5OZLF SOLDER WIRE MINI POCKET PACK Chip Quik Inc. |
69 |
|
Datasheet |
- | Bulk | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean | 20 AWG, 21 SWG | - | - | Tube, 0.50 oz (14.17g) | - | - | - |
|
NCSW.031 0.5OZSOLDER WIRE MINI POCKET PACK 63/ Chip Quik Inc. |
59 |
|
Datasheet |
- | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Tube, 0.50 oz (14.17g) | - | - | - |
|
NCSW.020 0.3OZSOLDER WIRE MINI POCKET PACK 63/ Chip Quik Inc. |
38 |
|
Datasheet |
- | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean | 24 AWG, 25 SWG | - | Leaded | Tube, 0.3 oz (8.51g) | - | - | - |
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