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Solder
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Mesh Type | Process | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMD291SNL10T5SOLDER PASTE LF T5 10CC Chip Quik Inc. |
10 |
|
Datasheet |
- | Dispenser | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD291AX250T3SOLDER PASTE SN63/PB37 250G Chip Quik Inc. |
38 |
|
Datasheet |
- | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
BARSN99.3CU0.7SOLDER BAR SN99.3/CU0.7 1LB SUPE Chip Quik Inc. |
28 |
|
Datasheet |
Super Low Dross™ | Bulk | Active | Bar Solder | Sn99.3Cu0.7 (99.3/0.7) | - | 441°F (227°C) | - | - | - | Lead Free | Bar, 1 lb (454g) | - | - | - |
|
SMD291SNL250T3SOLDER PASTE SAC305 250G T3 Chip Quik Inc. |
6 |
|
Datasheet |
- | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 3 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD291SNL250T4SLDR PST NO-CLEAN SAC305 T4 250G Chip Quik Inc. |
13 |
|
Datasheet |
- | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD4300SNL250T4SLDR PST WATR SOL SAC305 T4 250G Chip Quik Inc. |
6 |
|
Datasheet |
CHIPQUIK® SMD4300 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
TS391SNL250THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
12 |
|
Datasheet |
- | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
|
SMDLTLFP250T3SOLDER PASTE SN42/BI58 250G Chip Quik Inc. |
4 |
|
Datasheet |
- | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 3 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMDLTLFP250T4SOLDER PASTE LOW TEMP T4 250G Chip Quik Inc. |
6 |
|
Datasheet |
- | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
TS391LT250THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
18 |
|
Datasheet |
- | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
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