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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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2013620-1CONN SOCKET PGA ZIF 989POS GOLD |
0 |
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- |
- | Tray | Active | PGA, ZIF (ZIP) | 989 (35 x 36) | 0.039" (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.039" (1.00mm) | - | - | Copper Alloy | Thermoplastic | - |
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1981837-1CONN SOCKET LGA 1366POS GOLD |
0 |
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Datasheet |
- | Tray | Obsolete | LGA | 1366 (32 x 41) | 0.040" (1.02mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040" (1.01mm) | - | - | Copper Alloy | Thermoplastic | - |
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8080-1G3-LFCONN TRANSIST TO-3 3POS TIN |
0 |
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Datasheet |
8080 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Tin | 200.0µin (5.08µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
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8-1437504-2CONN TRANSIST TO-3 3POS TIN |
0 |
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Datasheet |
8080 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Tin | 200.0µin (5.08µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
|
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8-1437504-0CONN TRANSIST TO-3 3POS GOLD |
0 |
|
Datasheet |
8080 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
|
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9-1437504-7CONN TRANSIST TO-3 3POS TIN |
0 |
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Datasheet |
8080 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Tin | 200.0µin (5.08µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
|
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9-1437504-1CONN TRANSIST TO-3 3POS GOLD |
0 |
|
Datasheet |
8080 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
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8058-1G29CONN TRANSIST TO-5 3POS GOLD |
0 |
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Datasheet |
8058 | Bulk | Active | Transistor, TO-5 | 3 (Round) | - | Gold | - | Beryllium Copper | Panel Mount | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
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8058-1G45CONN TRANSIST TO-5 8POS GOLD |
0 |
|
Datasheet |
8058 | Bulk | Obsolete | Transistor, TO-5 | 8 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
|
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8058-1G59CONN TRANSIST TO-5 3POS GOLD |
0 |
|
Datasheet |
8058 | Bulk | Active | Transistor, TO-5 | 3 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
|
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5-6437504-0CONN TRANSIST TO-3 3POS SILVER |
0 |
|
Datasheet |
8080 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Silver | - | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Silver | - | Beryllium Copper | Diallyl Phthalate (DAP) | -55°C ~ 125°C |
|
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1-1747890-2CONN SOCKET LGA 771POS GOLD |
0 |
|
Datasheet |
- | Tray | Obsolete | LGA | 771 (33 x 33) | 0.043" (1.09mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.043" (1.09mm) | - | - | - | Thermoplastic | -25°C ~ 100°C |
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XR2C-3200-HSGCONN IC SOCKET 32POS |
0 |
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Datasheet |
XR2 | Bulk | Active | Housing | 32 (1 x 32) | 0.100" (2.54mm) | - | - | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | - | - | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C |
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PLCC-044-F-NCONN SOCKET PLCC 44POS GOLD |
0 |
|
Datasheet |
PLCC | Tube | Obsolete | PLCC | 44 (4 x 11) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55°C ~ 125°C |
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PLCC-044-T-NCONN SOCKET PLCC 44POS TIN |
0 |
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Datasheet |
PLCC | Tube | Obsolete | PLCC | 44 (4 x 11) | 0.050" (1.27mm) | Tin | - | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55°C ~ 125°C |
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PLCC-084-T-NCONN SOCKET PLCC 84POS TIN |
0 |
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Datasheet |
PLCC | Tube | Obsolete | PLCC | 84 (4 x 21) | 0.050" (1.27mm) | Tin | - | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55°C ~ 125°C |
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IC-628-SGGCONN IC DIP SOCKET 28POS GOLD |
0 |
|
Datasheet |
IC | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Phosphor Bronze | Polyester, Glass Filled | -55°C ~ 125°C |
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ICO-314-SST-LCONN IC DIP SOCKET 14POS GOLD |
0 |
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Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | -55°C ~ 125°C |
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0475939000CONN SOCKET LGA 1366POS NICKEL |
0 |
|
Datasheet |
47594 | Tray | Obsolete | LGA | 1366 (32 x 41) | - | Nickel | 3.00µin (0.076µm) | - | Surface Mount | Closed Frame | Solder | - | Nickel | 3.00µin (0.076µm) | - | - | - |
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CUSTOM BGACONN SOCKET BGA CUSTOM |
0 |
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Datasheet |
Textool™ | - | Active | BGA | Custom | 0.026" ~ 0.050" (0.65mm ~ 1.27mm) | Custom | Custom | - | Through Hole | Custom | - | - | - | - | - | - | - |
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