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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    SIP1X02-041BLF

    SIP1X02-041BLF

    CONN SOCKET SIP 2POS GOLD

    Amphenol ICC (FCI)

    		 0
    RFQ
    		SIP1X02-041BLF

    Datasheet

         		SIP1x Bulk Obsolete SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    1-1747890-1

    1-1747890-1

    CONN SOCKET LGA 771POS GOLD

    TE Connectivity AMP Connectors

    		 0
    RFQ
    		1-1747890-1

    Datasheet

         		- Tray Obsolete LGA 771 (33 x 33) 0.043" (1.09mm) Gold - Copper Alloy Surface Mount Open Frame Solder 0.043" (1.09mm) - - - Thermoplastic -25°C ~ 100°C
    1761503-1

    1761503-1

    CONN SOCKET PGA 940POS GOLD

    TE Connectivity AMP Connectors

    		 0
    RFQ
    		1761503-1

    Datasheet

         		- Tray Active PGA 940 (30 x 30) 0.050" (1.27mm) Gold 30.0µin (0.76µm) - Surface Mount Closed Frame - - - - - - -
    8180-E1

    8180-E1

    CONN TRANSIST TO-3 4POS TIN

    Boyd Laconia, LLC

    		 0
    RFQ
    		8180-E1

    Datasheet

         		8180 Bulk Discontinued at Digi-Key Transistor, TO-3 4 (Oval) - Tin - Steel Through Hole Closed Frame Solder - Tin - Steel Polyamide (PA), Nylon, Glass Filled -
    100-006-050

    100-006-050

    CONN IC DIP SOCKET 6POS GOLD

    3M

    		 0
    RFQ
    		100-006-050

    Datasheet

         		100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-008-050

    100-008-050

    CONN IC DIP SOCKET 8POS GOLD

    3M

    		 0
    RFQ
    		100-008-050

    Datasheet

         		100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-008-051

    100-008-051

    CONN IC DIP SOCKET 8POS GOLD

    3M

    		 0
    RFQ
    		100-008-051

    Datasheet

         		100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-010-050

    100-010-050

    CONN IC DIP SOCKET 10POS GOLD

    3M

    		 0
    RFQ
    		100-010-050

    Datasheet

         		100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-014-050

    100-014-050

    CONN IC DIP SOCKET 14POS GOLD

    3M

    		 0
    RFQ
    		100-014-050

    Datasheet

         		100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-016-050

    100-016-050

    CONN IC DIP SOCKET 16POS GOLD

    3M

    		 0
    RFQ
    		100-016-050

    Datasheet

         		100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-016-051

    100-016-051

    CONN IC DIP SOCKET 16POS GOLD

    3M

    		 0
    RFQ
    		100-016-051

    Datasheet

         		100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-018-050

    100-018-050

    CONN IC DIP SOCKET 18POS GOLD

    3M

    		 0
    RFQ
    		100-018-050

    Datasheet

         		100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-018-051

    100-018-051

    CONN IC DIP SOCKET 18POS GOLD

    3M

    		 0
    RFQ
    		100-018-051

    Datasheet

         		100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-020-050

    100-020-050

    CONN IC DIP SOCKET 20POS GOLD

    3M

    		 0
    RFQ
    		100-020-050

    Datasheet

         		100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-020-051

    100-020-051

    CONN IC DIP SOCKET 20POS GOLD

    3M

    		 0
    RFQ
    		100-020-051

    Datasheet

         		100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-022-050

    100-022-050

    CONN IC DIP SOCKET 22POS GOLD

    3M

    		 0
    RFQ
    		100-022-050

    Datasheet

         		100 Bulk Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-024-051

    100-024-051

    CONN IC DIP SOCKET 24POS GOLD

    3M

    		 0
    RFQ
    		100-024-051

    Datasheet

         		100 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-028-050

    100-028-050

    CONN IC DIP SOCKET 28POS GOLD

    3M

    		 0
    RFQ
    		100-028-050

    Datasheet

         		100 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-028-051

    100-028-051

    CONN IC DIP SOCKET 28POS GOLD

    3M

    		 0
    RFQ
    		100-028-051

    Datasheet

         		100 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-032-050

    100-032-050

    CONN IC DIP SOCKET 32POS GOLD

    3M

    		 0
    RFQ
    		100-032-050

    Datasheet

         		100 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
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