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Solder
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Mesh Type | Process | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NC191LT50SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
8 |
|
Datasheet |
Smooth Flow™ | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 4 | Lead Free | Jar, 1.76 oz (50g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMDLTLFPT4SOLDER PASTE NO CLEAN SN42/BI57. Chip Quik Inc. |
6 |
|
Datasheet |
SMD | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD2180-25000SOLDER SPHERES SN63/PB37 .016" ( Chip Quik Inc. |
12 |
|
Datasheet |
SMD2 | Bulk | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.016" (0.40mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - |
|
SMD291SNLT4SOLDER PASTE NO CLEAN LEAD-FREE Chip Quik Inc. |
9 |
|
Datasheet |
SMD2 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD3SWLT.040 10GSN42/BI58 2.2% FLUX CORE SOLDER Chip Quik Inc. |
12 |
|
Datasheet |
SMD3 | Bulk | Active | Wire Solder | Bi58Sn42 (58/42) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | - | Lead Free | Spool, 0.35 oz (10g) | - | - | - |
|
SMD-SC-SN96AG4-0.031-1OZSN96/AG4 .031" SOLDER WIRE 1OZ S Chip Quik Inc. |
16 |
|
Datasheet |
SMD | Bulk | Active | Wire Solder | Sn96Ag4 (96/4) | 0.031" (0.79mm) | 430°F (221°C) | - | - | - | Lead Free | Spool | 60 Months | - | - |
|
RASWLF.031 4OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
16 |
|
Datasheet |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Lead Free | Spool, 4 oz (113.40g) | 60 Months | Date of Manufacture | - |
|
SMD2SWLT.040 10GSN42/BI57.6/AG0.4 2.2% FLUX CORE Chip Quik Inc. |
9 |
|
Datasheet |
SMD2 | Bulk | Active | Wire Solder | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | - | Lead Free | Spool, 0.35 oz (10g) | - | - | - |
|
SMDIN100INDIUM SOLDER WIRE (IN100) 0.031 Chip Quik Inc. |
52 |
|
Datasheet |
SMD | Bulk | Active | Wire Solder | In100 (100) | 0.031" (0.79mm) | 315°F (157°C) | - | 20 AWG, 21 SWG | - | Lead Free | Spool | - | - | - |
|
|
SMDSN60BI40TIN/BISMUTH SOLDER WIRE (SN60/BI Chip Quik Inc. |
20 |
|
Datasheet |
CHIPQUIK® | Bulk | Active | Wire Solder | Sn60Bi40 (60/40) | 0.031" (0.79mm) | 280°F ~ 338°F (138°C ~ 170°C) | - | - | - | Lead Free | Spool | 60 Months | Date of Manufacture | - |
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