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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
251-5949-01-0602CONN ZIG-ZAG ZIF 51POS GOLD 3M |
7 |
|
Datasheet |
Textool™ | Bulk | Active | Zig-Zag, ZIF (ZIP) | 51 (1 x 25, 1 x 26) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
256-1292-00-0602JCONN IC DIP SOCKET ZIF 56POS GLD 3M |
13 |
|
Datasheet |
Textool™ | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 56 (2 x 28) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | 0.070" (1.78mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
260-4204-01CONN SOCKET QFN 60POS GOLD 3M |
14 |
|
Datasheet |
Textool™ | Bulk | Active | QFN | 60 (4 x 15) | Gold | - | Beryllium Copper | Through Hole | Open Frame | 0.016" (0.40mm) | Solder | 0.016" (0.40mm) | - | Gold | Polyethersulfone (PES) | - | Beryllium Copper |
|
224-7397-55-1902CONN SOCKET SOIC 24POS GOLD 3M |
16 |
|
Datasheet |
Textool™ | Bulk | Active | SOIC | 24 (2 x 12) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 150°C | Gold | Polyethersulfone (PES), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
220-3342-00-0602JCONN IC DIP SOCKET ZIF 20POS GLD 3M |
3,920 |
|
Datasheet |
Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
240-1280-00-0602JCONN IC DIP SOCKET ZIF 40POS GLD 3M |
3,408 |
|
Datasheet |
Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
|
232-5205-01CONN SOCKET QFN 32POS GOLD 3M |
3,278 |
|
Datasheet |
Textool™ | Bulk | Active | QFN | 32 (4 x 8) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | - | Gold | Polyethersulfone (PES) | - | Beryllium Copper |
|
224-1286-00-0602JCONN IC DIP SOCKET ZIF 24POS GLD 3M |
2,461 |
|
Datasheet |
Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
224-5248-00-0602JCONN IC DIP SOCKET ZIF 24POS GLD 3M |
2,316 |
|
Datasheet |
Textool™ | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
214-7390-55-1902CONN SOCKET SOIC 14POS GOLD 3M |
1 |
|
Datasheet |
Textool™ | Bulk | Active | SOIC | 14 (2 x 7) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 150°C | Gold | Polyethersulfone (PES), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
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