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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
XR2A-2411-NCONN IC DIP SOCKET 24POS GOLD Omron Electronics Inc-EMC Div |
97 |
|
Datasheet |
XR2 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 10.0µin (0.25µm) | Beryllium Copper |
|
XR2P2041CONN SOCKET SIP 20POS GOLD Omron Electronics Inc-EMC Div |
96 |
|
Datasheet |
XR2 | Bulk | Active | SIP | 20 (1 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Threaded | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 10.0µin (0.25µm) | Brass |
|
XR2A-3201-NCONN IC DIP SOCKET 32POS GOLD Omron Electronics Inc-EMC Div |
55 |
|
Datasheet |
XR2 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
XR2C-3205CONN SOCKET SIP 32POS GOLD Omron Electronics Inc-EMC Div |
95 |
|
Datasheet |
XR2 | Bulk | Active | SIP | 32 (1 x 32) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
|
XR2C-2015CONN SOCKET SIP 20POS GOLD Omron Electronics Inc-EMC Div |
43 |
|
Datasheet |
XR2 | Bulk | Active | SIP | 20 (1 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 10.0µin (0.25µm) | Beryllium Copper |
|
|
XR2T-2021-NCONN IC DIP SOCKET 20POS GOLD Omron Electronics Inc-EMC Div |
2,092 |
|
Datasheet |
XR2 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, Seal Tape | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | Flash | Beryllium Copper |
|
|
XR2A-1625CONN IC DIP SOCKET 16POS GOLD Omron Electronics Inc-EMC Div |
2,795 |
|
Datasheet |
XR2 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | Flash | Beryllium Copper |
|
XR2A-0802CONN IC DIP SOCKET 8POS GOLD Omron Electronics Inc-EMC Div |
54 |
|
Datasheet |
XR2 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 29.5µin (0.75µm) | Beryllium Copper |
|
|
XR3G-6401CONN IC SOCKET 64POS Omron Electronics Inc-EMC Div |
7 |
|
Datasheet |
- | Box | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
XR2A-1411-NCONN IC DIP SOCKET 14POS GOLD Omron Electronics Inc-EMC Div |
4,325 |
|
Datasheet |
XR2 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 10.0µin (0.25µm) | Beryllium Copper |
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