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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
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1109800-28CONN IC DIP SOCKET 28POS GOLD Aries Electronics |
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Datasheet |
Correct-A-Chip® 1109800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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1109800-10CONN IC DIP SOCKET 10POS GOLD Aries Electronics |
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Datasheet |
Correct-A-Chip® 1109800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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1109800-12CONN IC DIP SOCKET 12POS GOLD Aries Electronics |
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Datasheet |
Correct-A-Chip® 1109800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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1109800-22CONN IC DIP SOCKET 22POS GOLD Aries Electronics |
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Datasheet |
Correct-A-Chip® 1109800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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1109800-24CONN IC DIP SOCKET 24POS GOLD Aries Electronics |
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Datasheet |
Correct-A-Chip® 1109800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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1109800-26CONN IC DIP SOCKET 26POS GOLD Aries Electronics |
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Datasheet |
Correct-A-Chip® 1109800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 26 (2 x 13) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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1109800-8CONN IC DIP SOCKET 8POS GOLD Aries Electronics |
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Datasheet |
Correct-A-Chip® 1109800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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1109681-308CONN IC DIP SOCKET 8POS GOLD Aries Electronics |
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Datasheet |
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Spacer | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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1109681-316CONN IC DIP SOCKET 16POS GOLD Aries Electronics |
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Datasheet |
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Spacer | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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1109681-632CONN IC DIP SOCKET 32POS GOLD Aries Electronics |
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Datasheet |
- | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Spacer | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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