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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
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808-AG11D-ES-LFCONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors |
0 |
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Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
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2-1571586-9CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors |
0 |
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Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
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508-AG10DCONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors |
0 |
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Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | - | -55°C ~ 125°C |
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516-AG10DCONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
0 |
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Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | - | Brass | - | -55°C ~ 125°C |
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2-641616-1CONN IC DIP SOCKET 40POS TIN TE Connectivity AMP Connectors |
0 |
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Datasheet |
Diplomate DL | Box | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic | -55°C ~ 105°C |
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5-1571551-0CONN IC DIP SOCKET 32POS GOLD TE Connectivity AMP Connectors |
0 |
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Datasheet |
500 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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5-1571551-2CONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors |
0 |
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Datasheet |
500 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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4-1571551-4CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
0 |
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Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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1-1571994-0CONN SOCKET SIP 10POS GOLD TE Connectivity AMP Connectors |
0 |
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Datasheet |
510 | Tube | Obsolete | SIP | 10 (1 x 10) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 20.0µin (0.51µm) | Copper | Thermoplastic, Polyester | - |
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643648-3CONN SOCKET SIP 16POS TIN TE Connectivity AMP Connectors |
0 |
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Datasheet |
Diplomate DL | Box | Obsolete | SIP | 16 (1 x 16) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
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