KATY Electronic Technology Co., LTD - IC Sockets - Sockets for ICs, Transistors - page 16 - Original source of goods - Electronic Components Supplier | IC Distributor

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
110-41-320-41-001000 CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp.	525	-	RFQ	Datasheet	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
115-93-318-41-003000 CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp.	2,514	-	RFQ	Datasheet	115	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
8452-21B1-RK-TP CONN SOCKET PLCC 52POS TIN 3M	1,883	-	RFQ	Datasheet	8400	Tube	Active	PLCC	52 (4 x 13)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
4606 CONN TRANSIST TO-3 3POS TIN Keystone Electronics	888	-	RFQ	Datasheet	-	Bulk	Active	Transistor, TO-3	3 (Rectangular)	-	Tin	-	Brass	Chassis Mount	Closed Frame	Solder	-	Tin	-	Brass	Polyester, Glass Filled	-
114-87-328-41-134161 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	2,271	-	RFQ	Datasheet	114	Box	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
A-CCS 084-Z-T IC PLCC SOCKET 84POS TIN Assmann WSW Components	649	-	RFQ	Datasheet	-	Tube	Active	PLCC	84 (4 x 21)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-40°C ~ 105°C
123-87-316-41-001101 CONN IC DIP SOCKET 16POS GOLD Preci-Dip	555	-	RFQ	Datasheet	123	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
54020-44030LF CONN SOCKET PLCC 44POS TIN Amphenol ICC (FCI)	1,612	-	RFQ	Datasheet	-	Tube	Active	PLCC	44 (4 x 11)	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Polyphenylene Sulfide (PPS)	-40°C ~ 105°C
917-43-104-41-001000 CONN TRANSIST TO-5 4POS GOLD Mill-Max Manufacturing Corp.	340	-	RFQ	Datasheet	917	Tube	Active	Transistor, TO-5	4 (Round)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	-	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
AR 20-HZW/TN CONN IC DIP SOCKET 20POS GOLD Assmann WSW Components	1,862	-	RFQ	Datasheet	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
110-87-632-41-001101 CONN IC DIP SOCKET 32POS GOLD Preci-Dip	1,879	-	RFQ	Datasheet	110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
SA486040 CONN IC DIP SOCKET 48POS GOLD On Shore Technology Inc.	106	-	RFQ	Datasheet	SA	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	80.0µin (2.03µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
110-93-318-41-001000 CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp.	559	-	RFQ	Datasheet	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-43-318-41-001000 CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp.	291	-	RFQ	Datasheet	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
4600 CONN TRANSIST TO-3 3POS TIN Keystone Electronics	596	-	RFQ	Datasheet	-	Bulk	Active	Transistor, TO-3	3 (Oval)	-	Tin	-	Brass	Chassis Mount	Closed Frame	Solder	-	Tin	-	Brass	Polyester, Glass Filled	-
110-93-320-41-001000 CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp.	833	-	RFQ	Datasheet	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-43-314-10-001000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	209	-	RFQ	Datasheet	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7), 4 Loaded	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
214-44-320-01-670800 CONN IC DIP SOCKET 20POS TIN Mill-Max Manufacturing Corp.	324	-	RFQ	Datasheet	214	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
8468-21B1-RK-TP CONN SOCKET PLCC 68POS TIN 3M	2,073	-	RFQ	Datasheet	8400	Tube	Active	PLCC	68 (4 x 17)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
8468-21A1-RK-TP CONN SOCKET PLCC 68POS TIN 3M	713	-	RFQ	Datasheet	8400	Tube	Active	PLCC	68 (4 x 17)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C

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